| 摘要 |
<p>The present concepts include ''1:1'' uniax (40) with one conductive through-hole per chip connection site, ''mirror chip'' testing, heat-sink bonding to chips, avoiding contact with conductive cleaved edge of chip, indium solid columns, metal recessed (41) in the through-holes. All of these are subject to preferred materials (UPILEX polyimide) and techniques (U.V. laser ablation, minimum taper of holes).</p> |
