| 摘要 |
A thick film resistor paint is disclosed, wherein a base metal powder, such as tin oxide powder, is coated with a resinate solution, such as an Mn resinate solution, and the resinate coated powder thus formed is prefired in a reducing atmosphere to form a pre-reacted conductive powder. The pre-reacted conductive powder is then mixed with a glass frit, an oxide of hafnium, and a screening agent to form a thick film resistive paint having a sheet resistivity of from 500,000 ohms to 5 megohms per square. The resistive paint is subsequently screened upon a substrate and fired in an inert atmosphere, preferably at 900 DEG C.+/-20 DEG C., to form a thick film base metal resistor exhibiting a combined TCR within +/-200 ppm/ DEG C. The glass frit is preferably a tantala glass frit. |
