| 摘要 |
PURPOSE:To improve decomposition and dissipation of components of an organic binder during baking of a ceramic multilayer interconnection substrate produced by laminating green sheets, by providing a plurality of dissipating hollow through holes such that the holes pass through a plurality of substrates constituting the substrate. CONSTITUTION:Internal interconnections on layers of a multilayer interconnection substrate 1 are insulated from each other by insulating layers 6, while they are electrically connected with each other, where required, through conducting through holes 4. Surface electrodes 2 are also connected with the internal interconnections 3 through the through holes 4. Since the substrate has dissipating through holes 5 extending from the top to the rear of a plurality substrates, components of an organic binder can be decomposed or dissipated with improved efficiency when the substrate is baked and, thereby, degree of sintering of the board can be improved. The internal face of the dissipating through hole can be metallized by a plating technique so that the top and the rear of the board can be connected electrically with each other. In this manner, the multilayer interconnection substrate having high density can be expected. |
