| 摘要 |
PURPOSE:To manufacture high quality products subjected to no residual stress etc., at low cost without using a seal material by a method wherein the bonding surface of a semiconductor chip mounting board of a semiconductor device and a sealing cap is sealed by welding process using the ultrasonic welding process. CONSTITUTION:Leads 4 and a conductor pattern 5 are previously formed on a plastic 1 such as polyphenylenesulfide(P.P.S). At this time, a cavity 6 is formed wherein, after die-bonding a semiconductor chip 2, a molding 9 and a metallic cap 10 are fixed between a base 7 and a tool horn 8 by ultrasonic welding process so that they may be impressed with ultrasonic oscillation by the tool horn 8 to perform insert welding process 11. |
