发明名称 |
Sealing structure, method of soldering and process for preparing sealing structure |
摘要 |
This invention discloses a method of soldering together at least two members selected form metals and ceramics, which comprises successively jointing a high-melting jointig material, a medium-melting jointing material, and a low-melting jointing material, and a sealing structure prepared by this method. The method according to present invention enables the preparation of a sealing structure having a soldered area which is excellent in tightness.
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申请公布号 |
US4854495(A) |
申请公布日期 |
1989.08.08 |
申请号 |
US19870063419 |
申请日期 |
1987.06.18 |
申请人 |
HITACHI, LTD. |
发明人 |
YAMAMOTO, AKIHIKO;KOHNO, AKIOMI;YAMADA, TOSHIHIRI;SATOU, MOTOHIRO;TAGUCHI, KEIJI;YOKOI, KAZUAKI |
分类号 |
B23K1/18;B23K1/19;B23K35/00;C04B37/00;C04B37/02;H01L21/50 |
主分类号 |
B23K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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