发明名称 Sealing structure, method of soldering and process for preparing sealing structure
摘要 This invention discloses a method of soldering together at least two members selected form metals and ceramics, which comprises successively jointing a high-melting jointig material, a medium-melting jointing material, and a low-melting jointing material, and a sealing structure prepared by this method. The method according to present invention enables the preparation of a sealing structure having a soldered area which is excellent in tightness.
申请公布号 US4854495(A) 申请公布日期 1989.08.08
申请号 US19870063419 申请日期 1987.06.18
申请人 HITACHI, LTD. 发明人 YAMAMOTO, AKIHIKO;KOHNO, AKIOMI;YAMADA, TOSHIHIRI;SATOU, MOTOHIRO;TAGUCHI, KEIJI;YOKOI, KAZUAKI
分类号 B23K1/18;B23K1/19;B23K35/00;C04B37/00;C04B37/02;H01L21/50 主分类号 B23K1/18
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