发明名称 MOUNTING METHOD FOR ELECTRONIC COMPONENT
摘要 <p>PURPOSE:To enable mounting of electronic components suitable for assembling by the use of many pins, by connecting an electrode part of electronic component and a wiring electrode part of a wiring substrate with electrically conductive paste. CONSTITUTION:Electrode wiring is made by printed wiring 2 on the surface of a printed substrate 1. Electrically conductive paste 3 is formed in a pad shape by screen printing and the like on electrode wiring. Electrode take-out chip pads 4 of chips 5 are stuck on the paste 3. Thus, electronic components suitable for assembling by the use of many pins, namely the mounting of the chips 5 is allowed. The electrically conductive paste 3 may be a high polymer electric conductor such as polyaniline and mixed with Ag powder and Al powder or solder powder and carbon powder in resin such as epoxy resin and polyimide.</p>
申请公布号 JPH01196844(A) 申请公布日期 1989.08.08
申请号 JP19880022201 申请日期 1988.02.02
申请人 SEIKO EPSON CORP 发明人 IWAMATSU SEIICHI
分类号 H01L21/60;H01B1/12;H05K3/32 主分类号 H01L21/60
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