| 摘要 |
<p>PURPOSE:To reduce stress generated on integral-sintering by interposing a molded body not sintered and composed of a mixed material, in which different kinds of materials are mixed at a fixed ratio, between joint surfaces of molded bodies not sintered and each consisting of material of a different kind, and by integrally sintering the molded bodies. CONSTITUTION:In a sintered body 1 for a composite electronic part, a molded body 2 not sintered and made of a dielectric material as a first kind of material and a molded form 3 not sintered and consisting of a magnetic substance as a second kind of material are joined mutually through a layer of an intermediate molded body 4 not sintered and composed of a mixed material, in which these dielectric material and magnetic substance are mixed at a fixed ratio, and fired integrally. The mixed material naturally has a shrinkage factor and a thermal expansion coefficient between those of both different materials or closer to one of them according to the mixing ratio of the both materials. Accordingly, stress generated on the joining surfaces of the molded bodies not sintered and consisting of the different materials is reduced considerably as a result of such integral sintering.</p> |
