摘要 |
PURPOSE:To enable a ball to be formed by virtue of a fixed lead used as a discharge electrode and to shorten a bonding cycle and improve productivity, by applying voltage between a metal wire and the lead and by causing discharging and melting to form the ball. CONSTITUTION:An electrical discharge is generated between the tip end of a metal wire 2 and a lead frame 4 by applying positive or negative voltage to the metal wire 2 to melt the metal wire 2 for formation of a ball. By using the lead frame 4 as a discharge electrode, the amount of lifting of a capillary 3 after cutting down the metal wire 2 for formation of the ball, and the amount of the successive lowering of the capillary are reduced to shorten a bonding cycle. Additionally, since the lead frame 4 as the discharge electrode is fixed by a lead frame cap 9, the ball can stably be formed without any vibration, thereby improving the productivity and reliability of the wire bonding. Furthermore, there are needed no discharge electrode and no mechanism to drive the same, leading to the reduced cost of the wire bonding device. |