发明名称 MANUFACTURE OF COPPER-PRESSED METALLIC BASE SUBSTRATE
摘要 PURPOSE:To obtain a copper-clad metallic base substrate of high heat dissipation capacity, by spraying molten ceramics on copper leaf to form a ceramic layer, placing a prepreg of a carbon fiber base material between the ceramic layer and a metal plate which is a base, and performing thermocompression to form an integrated body. CONSTITUTION:Molten alumina is sprayed on the rough surface of 35mum thick electrolytic copper leaf 1 with a plasma spraying equipment to form a 150mum thick alumina sprayed layer 2. A prepreg 4 of carbon fiber base material and epoxy resin is placed between the side of the alumina sprayed layer of the copper leaf 1 having the alumina sprayed layer 2 and a 1mm thick 42-alloy plate 3 and thermocompression forming is performed for 90 minutes at 130 deg.C and under a pressure of 10kg/cm<2>. This metallic base substrate has high heat dissipation capacity and the blow holes of the alumina layer formed by spraying are completely closed because said blow holes are impregnated with the epoxy resin of a viscosity decreased when thermocompression forming with the prepreg of carbon fiber base material is performed.
申请公布号 JPH01194491(A) 申请公布日期 1989.08.04
申请号 JP19880019933 申请日期 1988.01.29
申请人 HITACHI CHEM CO LTD 发明人 HASEGAWA HIROSHI;INOUE MITSUHIRO;OKANO TOKUO
分类号 H05K1/05 主分类号 H05K1/05
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