发明名称 COPPER-CLAD MULTILAYER LAMINATE
摘要 PURPOSE:To obtain a copper-clad multilayer laminate with excellent drill workability, antimeasling capability, and formability without generating any voids, by using prepreg made by impregnating and drying a thermosetting resin into a nonwoven fabric containing an inorganic filler, as a sheet of prepreg keeping in contact with each side of an inside layer plate, out of a plurality of sheets of prepreg. CONSTITUTION:One or more sheets of prepreg made by impregnating and drying a thermosetting resin into a glass nonwoven fabric containing an inorganic filling agent is lapped, on each side of an inside layer plate 1 having formed- circuits on both the sides, in other words, in contact with the inside layer plate 1. Next, a sheet of prepreg 3 made by impregnating and drying a thermosetting resin into an usual glass cloth is lapped on each side of the upper and lower sides. In addition to that, on each side, outside layer cupper foil 4 is lapped, and a copper-clad multilayer laminate is completed by forming them into one body with heat and pressure applied. This improves the fluidity of the prepreg in time of being worked, and prevents voids from being generated.
申请公布号 JPH01194499(A) 申请公布日期 1989.08.04
申请号 JP19880019123 申请日期 1988.01.29
申请人 TOSHIBA CHEM CORP 发明人 MIURA SATOSHI;UCHIDA NOBUHIKO
分类号 H05K3/46 主分类号 H05K3/46
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