| 摘要 |
PURPOSE:To restrict galvanic corrosion due to traveling of copper ion at high temperature, high humidity, and high voltage by performing Ni plating of an inner-layer circuit and a penetration hole. CONSTITUTION:By etching a substrate wherein copper foil is laminated to an insulation base material 1, a copper inner-layer circuit 2 is provided. An inner-layer circuit 3 by Ni plating is formed up to a thickness of 10mum or more in the inner-layer circuit 2. An insulation layer 4 is provided on the front and back surfaces of the printed-circuit board, a penetration hole 5 is made, and an inner-wall surface 6 is covered with an Ni plating 8 wherein the thickness exceeds 15mum. According to this configuration, galvanic corrosion due to traveling of copper ion is restricted at high temperature, high humidity, and high voltage and a highly reliable multi-layer printed-wiring hoard can be obtained. |
