| 摘要 |
PURPOSE:To reduce an irregularity in the thickness of a soft solder between a semiconductor pellet and a lead frame by forming a recess on the soft solder coating face of the frame. CONSTITUTION:A recess 3 is formed on the semiconductor pellet adhering face 1 of a lead frame to limit the irregularity in the extension of a soft solder 4 by the recess 3, and when a semiconductor pellet 5 is adhered thereonto, the pellet 5 and the solder 4 on the frame have no irregularity in thicknesses and are formed in a uniform structure. Thus, uniform thickness 6 of the soft solder is obtained, thereby improving step capacity and reliability.
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