| 摘要 |
PURPOSE:To enable the mass production of high-reliability solder masks by coating a high-polymer binder which is soluble in an aq. alkaline soln. and is insoluble in water, a specific epoxy-contg. unsatd. compd. and a photosensitive resin compsn. on a substrate and curing the prescribed parts by exposing to form protective films, then depositing solder on the other parts. CONSTITUTION:The high-polymer binder which is soluble in the aq. alkaline soln. and insoluble in water, the epoxy-contg. unsatd. compd. which is obtd. by bringing triglycidyl isocyanurate and unsatd. group-contg. monocarboxylic acid into addition reaction in a 0.3-0.9 range of acid equiv./epoxy equiv. ratio and the photosensitive resin compsn. which contains a sensitizer and/or sensitizer system forming free radicals when irradiated with active rays are coated on the surface of the circuit substrate by using a curtain flow coater. The prescribed parts are then cured by exposing to form the protective films and the solder is deposited to the parts which are not protected by the protective films on the substrate. The high-reliability solder masks having excellent resolution and heat resistance are thereby mass-produced. |
