| 发明名称 |
LASER BONDING APPARATUS AND METHOD |
| 摘要 |
<p>A method and apparatus of bonding two electrical members together uses a pulsed YAG laser. Various apparatus and methods may be used to hold the electrical members in contact under pressure to insure uniform bonding. Automation production equipment provides for the automatic bonding of the flat electrical leads of a TAB tape to the flat electrical bumps on a plurality of integrated circuit dies.</p> |
| 申请公布号 |
AU2879989(A) |
申请公布日期 |
1989.08.03 |
| 申请号 |
AU19890028799 |
申请日期 |
1989.01.25 |
| 申请人 |
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION |
发明人 |
DANIEL MARSHALL ANDREWS;PHILLIP JAMES SPLETTER;RICHARD LINN SIMMONS |
| 分类号 |
B23K1/005;H01L21/00;H01L21/60;H01L21/68;(IPC1-7):H01L23/50;H01L21/92;B23K26/08;H01L21/98 |
主分类号 |
B23K1/005 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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