| 摘要 |
<p>PURPOSE:To easily and effectively bond a large die as well as small die by removing the die held by a collet by suction once and placing it on a surface to be bonded. CONSTITUTION:A bonding arm 4 is moved forward or rearward and upward or downward by elevationally driving means 6 and longitudinally driving means 7, a die 1 is held by a collet 5 by suction, and fed onto the surface 3 to be bonded of a material 2 to be bonded. Then, the vacuum suction of the collet 5 is stopped by a control circuit 12, and the arm 4 is then raised from the surface to be bonded. As a result, the die is released from a restricted state by the collet, and placed with its rear face closely contact with the surface to be bonded due to gravity. Then, the whole rear face of the die is heated. Thereafter, the arm 4 is moved down, the die is again pressed and held by the collet, the collet is simultaneously operated to scribe the die by the rotation of a cam 11, an Au-Si eutectic crystal is generated on a boundary between the rear face and the surface to be bonded, thereby performing the adhering of the die.</p> |
