摘要 |
PURPOSE:To suppress the input of stray light into sensor parts and to prevent the formation of a parasitic capacitor, by attaching a light stopping film comprising black insulating resin on the surface of the light receiving side of a chip other than the sensor parts and electrode parts. CONSTITUTION:A thin film as a light stopping film 6 comprising black polyimide resin is thinly formed on a protecting film other than sensor parts 1a and electrode pad parts 1b on the surface of the light receiving side of a photodetector 1. The protecting film is formed on the surface of the main body side of a chip 1. The film 6 is formed by a suitable patterning method. The photodetector 1 comprising said constitution is mounted on a die pad 2 and bonded to a lead frame 3 with wires. Then, the photodetector is sealed in a resin package 5. |