| 摘要 |
<p>1293801 Printed circuits CLEVITE CORP 30 Sept 1969 [3 Oct 1968] 48099/69 Heading H1R [Also in Division C7] A copper foil is coated with a thin barrier layer of one of the metals zinc, indium or brass bu electrodeposition to form the conductor element in a printed circuit board when mounted on a resinous substrate. The foil may be pre-treated to have dendrites or particles of copper or copper and copper oxide on its surface, the barrier layer encapsulating the dendrites or particles. In manufacture the foil is drawn through a plating bath, examples being given of the plating solutions used, and the thicknesses of the respective layers deposited. The peeling strength of the foil on the resinous substrate is improved, and staining of the substrate is eliminated. The layer may be applied by vapour deposition.</p> |
