| 摘要 |
PURPOSE:To omit connection to an external capacitor, to remove high frequency noises and to implement high density mounting, by incorporating a bypass capacitor as a unitary body in an IC package, and connecting the capacitor between the power source pins of an IC element. CONSTITUTION:An insulating film 7 comprising dielectric material is provided between metal films 6a and 6b which are connected to power source pins 5a and 5b. A parallel-plate capacitor is formed and made to be a bypass capacitor 8. The capacitor can be incorporated as a unitary body in a space 1a of a package 1. Connection can be performed at the closest position to an IC element 2. Frequency noises generated in the IC element 2 can be effectively removed. |
