| 摘要 |
A lubricating composition for use in slicing or cutting silicon wafers. The composition includes a soap, a phosphorous containing compound, and an ethylene oxide-propylene oxide polymer. The phosphorous compound is a low temperature, extreme pressure lubricant. The ethylene oxide propylene oxide polymer is a high temperature, extreme pressure lubricant. Suitable soaps include C6-C18 fatty acids reacted with triethanolamine or aminoethanolamine. Additionally, biocides or fungicides may be added. Also an antifoam and a complexing aid such as EDTA may be used.
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