A wafer probe comprises a support member having an end region which is shaped to permit the end region to be brought into close proximity with a component under test. An amplifier is mounted on the support member at its end region. A conductive probe element is attached to the amplifier and is electrically connected to the amplifier's input terminal. A transmission line is connected to the amplifier's output terminal for transmitting signals from the amplifier to a measurement instrument.
申请公布号
US4853627(A)
申请公布日期
1989.08.01
申请号
US19880217107
申请日期
1988.07.11
申请人
TRIQUINT SEMICONDUCTOR, INC.
发明人
GLEASON, KIMBERLY R.;STRID, ERIC W.;FLEGAL, ROBERT T.;MCCAMANT, ANGUS J.