| 摘要 |
PURPOSE:To improve mounting density, to prevent the bending of leads and to make it possible to prevent electrostatic breakdown due to contact of the lead, by providing a state wherein the lead is not extruding out of a package but embedded, and providing a hole which is communicated to each embedded lead. CONSTITUTION:A plurality of leads are formed around the periphery of a tab 2 for mounting a semiconductor chip 1 so that one end of each lead is close to the vicinity of a tab and the other end is embedded without protrusion from a resin package 3. Each through hole 5 is communicated to at least one surface of each lead 6. Thus, the through hole 5 is provided in correspondence with the lead 6. A hole 4 is provided in the lead 6 in conformity with the through hole 5. The hole 4 is formed so that, e.g., the tip of a pin as an outer contact that is provided on a mounting substrate can be inserted into said hole and connected. A piece of bonding wire 7 is used to connect the electrode of the semiconductor chip 1 and each lead 6. |
