| 摘要 |
PURPOSE:To prevent an insulating film from damaging due to the displacement of press-bonding of a bonding ball or to prevent it from short-circuiting with a guard ring by forming the ring so thinly as to eliminate an overhang of the step of the film covering the ring. CONSTITUTION:A base bonding pad 2 made of aluminum electrode extended from a base n-type diffused layer 9 is provided on a collector (p-type Si substrate) 11, a guard ring 1 formed of a polysilicon film is provided near it, and the final face is covered with a surface protective film 3 of PSG (phosphosilicate glass) except the pad. The ring is formed of a thin film, the protective film can obtain its sufficient thickness on the surface and side face of the ring without overhanging the film on the step, thereby preventing the film from short- circuiting due to the displacement of a press-bonding ball in case of bonding. |
