| 发明名称 |
HIGH PRESSURE BONDING PROCESS |
| 摘要 |
The invention provides a method for inserting a cylindrical body (34) into a larger body (42) by bonding. The cylindrical body (34) may contain defects (28) positioned at a predetermined location. After bonding, the combined structure may be machined to produce a body having a fault positioned at a predetermined location therein. |
| 申请公布号 |
WO8906583(A1) |
申请公布日期 |
1989.07.27 |
| 申请号 |
WO1989US00098 |
申请日期 |
1989.01.10 |
| 申请人 |
ELECTRIC POWER RESEARCH INSTITUTE, INC.;FINDLAN, SHANE, J. |
发明人 |
FINDLAN, SHANE, J. |
| 分类号 |
B23K20/00;B23K20/02;(IPC1-7):B23K20/00 |
主分类号 |
B23K20/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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