发明名称 Contacting device for test purposes, particularly for testing semiconductor chips
摘要 The contacting device consists of a contact probe (1) with a metallic carrier body (2) which exhibits at one end a plug connection (8) for a coaxial line (9). A guide sleeve (3) which is extended by a guide tube (5) for a contact needle (4) is mounted in the carrier body (2). The needle (4) is mounted movably in the axial direction and establishes the contact to the test point. The guide tube (5) is surrounded over its entire length by a jacket (6) of insulating material onto which a layer (7) of conductive material is applied which is connected to the carrier body (2). This simulates a coaxial line, the characteristic impedance of which matches the characteristic impedance of the coaxial line (9) connected to the contact probe (1) due to the choice of insulating material as dielectric and due to the dimensions. This provides for nearly reflection-free signal transmission from the test point to the plug connection (8). <IMAGE>
申请公布号 DE3801222(A1) 申请公布日期 1989.07.27
申请号 DE19883801222 申请日期 1988.01.18
申请人 SIEMENS AG, 1000 BERLIN UND 8000 MUENCHEN, DE 发明人 SEIDEL, WOLFGANG, 8000 MUENCHEN, DE
分类号 G01R1/073 主分类号 G01R1/073
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