| 摘要 |
<p>Disclosed is a sensitizing activator for chemical plating operations, that uniformly and efficiently deposits a substance capable of catalytically depositing a plating metal from a plating solution, such as colloidal palladium, on the surface of a material to be plated. The activator includes stannous chloride and palladium chloride colloidally dispersed in a solution of sodium chloride and a dilute concentration of an acid which is preferably sulfuric acid. A preferred formulation includes a small amount of vanillin. The activator provides exemplary permeation of and adhesion to a substrate to be plated, and advantageously avoids corrosion of the black oxide that is formed on the inner copper foil of copper-clad laminates.</p> |
