发明名称 MEANS AND METHOD FOR SOLDERING AND DESOLDERING ELECTRONIC COMPONENTS
摘要 <p>A soldering iron which is developed specifically to address a wide variety of miniaturized integrated circuit soldered pin configurations has a handle (20) with a heating block (34) which mounts one of a set of wide, chisel-shaped blades (40) that are engaged in a deep channel (38) in the heating block and which taper gradually to a knife edge (41) which is the operative edge of the soldering head. The wide, thin, extensively tapered and knife-edged blade (40) usually addresses a row of integrated circuit pins or surface mounted leads to act brush-like to solder them substantially simultaneously, or to heat them simultaneously when desoldering the row to remove the component.</p>
申请公布号 WO1989006581(A1) 申请公布日期 1989.07.27
申请号 US1988000172 申请日期 1988.01.19
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