发明名称 MEANS AND METHOD FOR SOLDERING AND DESOLDERING ELECTRONIC COMPONENTS
摘要 A soldering iron which is developed specifically to address a wide variety of miniaturized integrated circuit soldered pin configurations has a handle (20) with a heating block (34) which mounts one of a set of wide, chisel-shaped blades (40) that are engaged in a deep channel (38) in the heating block and which taper gradually to a knife edge (41) which is the operative edge of the soldering head. The wide, thin, extensively tapered and knife-edged blade (40) usually addresses a row of integrated circuit pins or surface mounted leads to act brush-like to solder them substantially simultaneously, or to heat them simultaneously when desoldering the row to remove the component.
申请公布号 WO8906581(A1) 申请公布日期 1989.07.27
申请号 WO1988US00172 申请日期 1988.01.19
申请人 KIM, HENRY 发明人 KIM, HENRY
分类号 B23K3/02;H05K3/34;(IPC1-7):B23K3/02 主分类号 B23K3/02
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