| 摘要 |
<p>PURPOSE:To reduce cracks at a resin sealing part by so forming the shape of a tab as to improve the adhesive properties of the tab with the boundary of a resin and to alleviate a stress concentration at the time of allowing the solder of a lead to reflow or temperature cycle. CONSTITUTION:The tab 1 of the lead frame of a resin-sealed semiconductor device is formed in a-shaped metal thin plate structure. Thus, since the lower face of a pellet 1 placed on the tap 1 is almost exposed, a boundary between the pellet and the resin 5 is also formed on the lower face of the pellet 2, the area of an effective tab 1 is reduced, thereby alleviating a generated stress. Accordingly, the adhesive properties of both can be improved, and a stress concentration at the time of allowing the solder of an outer lead 3B to flow or temperature cycle can be moderated. Thus, a gap at the boundary between the pellet 2 and the resin 5 can be reduced. As a result, since the cracks of the sealing part of the resin 5 can be reduced, the reliability of a resin-sealed semiconductor device can be improved.</p> |
