发明名称 CUTTING DEVICE AND CUTTING METHOD FOR RESIN MOLDING
摘要 <p>PURPOSE:To cut a large work at high speeds by controlling the total processes of attracting of the work, conveyance of the work to a cutting zone, cutting of the work in the cutting zone, discharging chips, and conveyance of finished work to a discharge zone in the logical sequence. CONSTITUTION:An adsorption plate 9 of a conveying device is lowered to attract a work (a) made of a resin to itself. Then pairs of longitudinal cutting tools 31 are moved to each cutting position by an advance-retract travel control mechanism to cut each par of both right and left side edges of the work fed into a cutting zone II. After the cutting operation, the pairs of longitudinal cutting tools 31 are recessed and directd downward to discharge chips. Successively, the work is moved toward a pair of lateral cutting tools in front side in the feed direction, and a part of the front edge of the work is cut. After that, the work is moved toward a pair of lateral cutting tools 61 in the rear side in the feed direction, and then the rear edge of the work is cut. Next, the pairs of lateral cutting tools 61 are directed downward to discharge chips. After that, the finished work is discharged in a discharge zone III.</p>
申请公布号 JPH01188295(A) 申请公布日期 1989.07.27
申请号 JP19880011576 申请日期 1988.01.21
申请人 ASANO KENKYUSHO:KK 发明人 ASANO KAZUO;TAKAI TOSHIHIRO;KINOSHITA MASAYASU
分类号 B26D3/10;B23D31/00;B26D1/09;B26D3/00;B26D5/04;B26D7/18;B26F1/40;B29C51/44 主分类号 B26D3/10
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