| 摘要 |
PURPOSE:To obtain a metallizing compsn. having superior oxidation resistance and adhesion to ceramics by mixing Au powder with CuO, glass-based inorg. powder and resin in a specified ratio. CONSTITUTION:When ceramics calcined at a low temp. is metallized to produce electronic parts such as a ceramic package and a ceramic multilayered board, a mixture of 100 pts.wt. Au powder of about 1.5mum particle size with 2-7wt.% CuO powder of about 1.5mum particle size and 3-8wt.% resin is used as a metallizing compsn. For example, the surface of a ceramic substrate 1 is metallized with the Au-based metallizing compsn. 1a, the surfaces of inner substrates 2 are metallized with Cu 16 and Pt-Cu, Pd-Cu, Pt, Pd or Ni paste is filled into through holes 3 to form a metallized pattern. |
