| 摘要 |
<p>A comb-like array of electrical leads is provided, each having a solder mass and/or a locating structure at a terminal end, the array being in two sets for respective attachment to conducting areas on the top and bottom surfaces of a substrate (such as a printed circuit board), the leads being pivotable either at their stem ends (as in FIGS. 1-2, 21-22 and 31-33) or at an intermediate fulcrum (as in FIGS. 40-41). Resilient structures in the form of resilient bowed portions are formed in the leads, so that upon applying appropriate force to the resilient structures, the sets of leads are separated to accept a substrate therebetween, with the lead terminal ends aligned with respective contact pads on the substrate, and so that upon releasing such force, the leads will tend to return to their initial positions and thereby resiliently clamp the lead structure to the substrate, to be held there during subsequent soldering.</p> |
