| 摘要 |
PURPOSE:To reduce the mounting area of a device by loading semiconductor chips onto both the surface and the rear of a lead frame. CONSTITUTION:At least one first semiconductor chip 5a loaded on one surface of a lead frame 2, at least one second semiconductor chip 5b loaded at the position of loading of the first semiconductor chip 5a on the other surface of the lead frame 2 and a sheathing resin 8 formed, covering the outer circumferences of said first and second semiconductor chips 5a, 5b are included. A semiconductor device is constituted, containing the lead frame 2, the first semiconductor chip 5a fixed onto the top face of an island 3 for the lead frame, the second semiconductor chip 5b fastened onto the underside of the island 3, bonding wires 7a connecting electrode pads 6a for the semiconductor chip 5a and lead terminals 4, bonding wires 7b connecting electrode pads 6b for the semiconductor chip 5b and the lead terminals 4 and the sheathing resin 8.
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