| 摘要 |
PURPOSE:To conduct plating treatment in an inner lead in a metallic piece once, and to reduce manufacturing cost by composing a lead frame of the metallic piece using a copper alloy material, on the surface of which copper plating treatment is executed, as a blank and respectively setting the hardness and thickness of a plating layer in a wire bonding section within specific ranges. CONSTITUTION:A lead frame consists of a metallic piece 1 employing a copper group alloy material, on the surface of which copper plating treatment is executed, as a blank, and a plating layer 11 in a wire bonding section 6a in the metallic piece 1 has hardness smaller than Vickers hardness of 160 and thickness set in size larger than 500Angstrom . The plating layers 11 made up of copper are shaped to sections shown by oblique lines in the figure of the metallic piece 1 as the lead frame employing the copper alloy material (Cu-2%Sn-0.2%Ni) as the blank by using a copper cyanide group plating bath, and the hardness of the plating layers 11 in the wire bonding sections 6a for inner leads 6 is made smaller than Vickers hardness of 160 and thickness thereof is made larger than 500Angstrom . |
