PACKAGE FOR SEMICONDUCTOR DEVICE,申请号JP19880012885-传众专利搜索

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发明名称	PACKAGE FOR SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH01187956(A)	申请公布日期	1989.07.27
申请号	JP19880012885	申请日期	1988.01.22
申请人	MITSUBISHI ELECTRIC CORP	发明人	TAKEDA EIJI;SAKAYORI TAKAO
分类号	H01L23/40;H01L23/02;H01L23/04	主分类号	H01L23/40
代理机构		代理人
主权项
地址

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