发明名称 A COMBINED CONTINUOUS PLATING APPARATUS FOR HOT-DIP PLATING AND VACUUM DEPOSITION PLATING
摘要 The outlet of the gas reduction annealing furnace of a continuous hot dip plating apparatus is connected, through a pressurised chamber, to the inlet of the seal roll chamber of a continuous vacuum deposition plating apparatus. The pressurised chamber is detachable and is provided with a pressure regulation escape valve. The advantage is that each process can be selected by using the combined apparatus. In particular both single sided and double sided plating can be carried out, and platings of different thicknesses may be effected on each side of the strip. Thick platings may be carried out at high speeds.
申请公布号 KR890002742(B1) 申请公布日期 1989.07.26
申请号 KR19850006990 申请日期 1985.09.24
申请人 NISSIN SEIKO CO.,LTD.;MITSUBISHI HEAVY IND. CO.,LTD. 发明人 UMEDA, SHOZO;TSUKIJI, NORIO;AIKO, TAKUYA;KITTAKA, TOSHIHARU;FURUKAWA, HEIZABURO;WAKE, KANJI
分类号 C23C2/00;C23C2/40;C23C14/56;(IPC1-7):C23C2/00 主分类号 C23C2/00
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