发明名称 SUBSTRATE SURFACE TREATMENT EQUIPMENT
摘要 PURPOSE:To keep spray of a treatment fluid from sticking to the surface of a substrate as well as to keep the other equipment clean, by rotating the substrate, by supplying a treatment fluid from above and by providing the upper part of a treatment area of an equipment with a chimney-like cover. CONSTITUTION:With a substrate 1 rotated, a treatment fluid is supplied from above. At the same time, the upper part of a treatment area of equipment for processing the surface of the substrate 1 is provided with a chimney-like cover 7. Splay 6 splashed by the semiconductor wafer 1 on a rotation chuck table 2 while it is rotated is exhausted from an exhaust hole 4 without sticking to the surface of the semiconductor wafer 1 and does not make the other equipment dirty by scattering outside since the upper part of the treatment area is provided with a chimney-like cover 7 to make an air flow smoothly from above toward the exhaust hole 4.
申请公布号 JPH01186618(A) 申请公布日期 1989.07.26
申请号 JP19880005919 申请日期 1988.01.14
申请人 SEIKO EPSON CORP 发明人 TSUGANE HIROAKI
分类号 H01L21/304;B05C11/08;G03F7/00;G03F7/16;G03F7/30;H01L21/027;H01L21/30;H01L21/306 主分类号 H01L21/304
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