| 摘要 |
PURPOSE:To prevent peeling of a metal or metal alloy as well as contact of burr with wiring materials from occurring by performing patterning to the inside simultaneously with wiring at the scribe part and etching of PAD electrode itself. CONSTITUTION:A semiconductor element for monitoring is formed at the same time when the semiconductor element is formed and an Al wiring and PAD electrode 1 which are formed for confirming characteristics of semiconductor elements for monitoring are formed simultaneously in a form including a pattern which enables a part 2 without a parallel Al in dicing direction. Then, after the characteristics are confirmed using the PAD electrode 1, it flows into dicing process, the dicing process ends, and packaging process is completed without a burr 5 of scribe PAD being in contact with a bonding wire 4 when an external electrode and a bonding PAD 3 within chip are connected by a bonding wire 4. It prevents contact between bonding wire and burr in packaging process from occurring for reducing bonding failure. |
