发明名称 Trimming element for microelectronic circuit.
摘要 <p>A trimming element comprises (a) a medium layer (22), (b) a pair of electrodes (23a, 23b) connected to the medium layer (22), and (c) an alloy layer (24), which is formed of metal of the electrodes (23a, 23b) and material of the medium layer (22) and is created in the medium layer (22), for substantially short-circuiting the electrodes (23a, 23b) to each other. The alloy layer (24) is obtained by applying a laser beam to the medium layer (22) to heat a portion between the electrodes (23a, 23b). The metal layer (24) for substantially short-circuiting the electrodes (23a, 23b) is thus formed.</p>
申请公布号 EP0325234(A2) 申请公布日期 1989.07.26
申请号 EP19890100821 申请日期 1989.01.18
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 IMAMURA, KOARU C/O PATENT DIVISION;TAKAHASHI, WATARU C/O PATENT DIVISION
分类号 H01C17/22;H01C17/26;H01L21/82;H01L23/525;H01L27/01 主分类号 H01C17/22
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