发明名称 ELECTRONIC COMPONENT AND MANUFACTURE THEREOF
摘要 <p>PURPOSE:To prevent a resin section from removing from a lead by composing the resin section of thermal plastic resin and by extending it as a protrusion at least near an area where the lead is bent on the side opposite to the lead bending side. CONSTITUTION:A resin section is made of thermal plastic resin and composed of a main body section 6 which seals wire 4... and pellet 1 and a protrusion section 7 which covers the horizontal upper surface of a lead 2 which is provided to the main body section 6 and bent. Therefore, the shearing stress applied when the lead 2... is bent can be absorbed since the affinity of the lead 2... and the resin section 5 increases, the junction strength therebetween increases, and excellent toughness and flexibility are provided. In this way, the resin section 5 hardly removes from the lead 2..., especially at the bending process of the lead 2..., the resin section 5 is almost completely prevented from removing by pressing the lead 2... between a lead keeper and the protrusion section 7.</p>
申请公布号 JPH01186661(A) 申请公布日期 1989.07.26
申请号 JP19880004866 申请日期 1988.01.14
申请人 TOSHIBA CORP 发明人 ADACHI MASAKI;YOKOYAMA KIYOHARU
分类号 H01L21/56;H01L23/28;H01L23/50 主分类号 H01L21/56
代理机构 代理人
主权项
地址