Non-occluding mounting hole with solder pad for printed circuit boards

摘要

A novel solder pad configuration for printed circuit boards is disclosed which is resistant to solder occlusion upon wave soldering. On the solder side of the circuit board the solder pad is substantially C-shaped and partially surrounds a non-plated through-hole. Via holes prvide electrical connection between the pad on the solder side of the board and the corresponding pad on the component side of the circuit boards. The invention is particularly applicable to the chassis ground mounting holes of PCB's.