发明名称 Auatomatic inspection system for IC lead frames and visual inspection method thereof
摘要 The a system includes a visual inspection unit, a plating thickness inspection unit, and a shape inspection unit, suitably arranged in combination on the inspection line for automatic inspection of stains, flaws, glossiness or deformation in plated IC lead frames. The system can be used by an inventive method to correct errors in positional relation between a reference image and images input from an inspection camera, to obtain a comparison between a reference luminance curve and the individual luminance curves and the correlation between reflectivity and the corresponding area, and to obtain a comparison between the reference correlation and individual correlations to thereby enhance automation and precision in inspection IC lead frames.
申请公布号 US4851902(A) 申请公布日期 1989.07.25
申请号 US19870082097 申请日期 1987.08.05
申请人 ELECTROPLATING ENGINEERS OF JAPAN, LIMITED 发明人 TEZUKA, JUNICHI;KISHI, TAKAAKI;MURATA, YASUTO
分类号 B07C5/08;B07C5/10;B07C5/34;B07C5/342;G01R31/304;H01L21/00;H01L21/66 主分类号 B07C5/08
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