| 摘要 |
An improved epoxy resin composition having improved crack resistance and toughness with maintaining the excellent mechanical and electrical properties, which comprises an epoxy resin dispersed with silicone resin particles which are a crosslinking reaction product of one or more organopolysiloxanes having silanol groups at both ends and one or more organosilane compounds having at least two alkoxysilyl groups within one molecule thereof. The epoxy resin compositions of this invention are useful as sealing materials for IC, and also as coating materials, paints, adhesives, and prepregs.
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