| 摘要 |
PURPOSE:To simplify a process of manufacture and reduce a cost for the same without deteriorating the performance of a solar cell by oxidizing or nitrogenizing the surface of a silicon ingot. CONSTITUTION:After a wafer 10 is formed by oxidizing or nitrogenizing the surface of a silicon ingot I and slicing the ingot, an n+ layer 14 is formed on the face and rear of the wafer 10 to form electrodes 16, 17. Hereby, a masking material 151 is formed on the side of the wafer 10 which has been formed by slicing the silicon ingot I, thus eliminating the need of joining and separating the n+ layer 14. Thus, there are made unnecessary a process of resist application, a chemical etching process of removing the n+ layer on the sides and rear of the wafer, and a process of removing the resist layer after the chemical etching, etc., thereby simplifying the present process followed by reduced time required for the formation of the title cell. |
