INTEGRATED CIRCUIT DEVICE

摘要

PURPOSE:To make it possible to put an integrated circuit chip having a large consumption power in a small-sized flat package by a method wherein the parts, which come out of a sealing container, of lead pins led out from at least one direction of the container are formed in the same form as those of normal lead pins and moreover, a part, which is used as the interior of the container, is formed into a plane form to mold integrally with a part, on which a pellet is placed. CONSTITUTION:A mounting island part 2, a heat dissipation fin part 5 and leads 35-46 are formed integrally with one another and a flat package is made of one sheet of a metallic plate. If the package is constituted in such a structure, heat which is generated in a chip 3 is transmitted from the part 2 just under the chip 3 to the part 5, which is a metallic part having a good heat conductivity, and is dissipated in the air from here through a resin. Moreover, as the leads 41-46 are fixed with a copper foil part 8 by soldering, the heat transmitted to the heat dissipation fins 5 is conducted to the part 8 through the leads 41-46. That amount is far more than the amount of the heat, which is dissipated in the air from the fins 5, and this package functions as a package to dissipate heat favorably. Accordingly, the package is capable of withstanding up to a consumption power three times or thereabouts more than the existing consumption power and even an integrated circuit chip having a large consumption power due to a high speed or a high integration degree can be mounted.