发明名称 WAFER REPLACING METHOD
摘要 <p>PURPOSE:To reduce the contamination with foreign matters in a thermostatic chamber by a method wherein a wafer cassette is placed on a cassette stand on the load side and the unload side, and the cassette stand is picked up to outside the thermostatic chamber automatically. CONSTITUTION:An aperture 20 in the size in which a loading cassette 8 and an unloading cassette 10 can be taken in or out is provided at a part of the wall surface of a thermostatic chamber 11. When a wafer cassette is replaced, first, a cover 21 is rotated downward. An electromagnetic valve 23 is functioned by operating a switch, and a rod 25 is shifted by allowing compressed air to flow into an air cylinder 24. A wafer stand 26, on which a wafer cassette is placed, is connected to the tip of the rod 25. The wafer cassette is passed through the aperture part 20 of the wafer chamber 11, and picked up to outside of the chamber 11. As a result, the contamination in the chamber 11 with foreign matters can be reduced.</p>
申请公布号 JPH01184821(A) 申请公布日期 1989.07.24
申请号 JP19880004729 申请日期 1988.01.14
申请人 HITACHI LTD 发明人 KURIMOTO KOZO
分类号 G03F7/20;H01L21/027;H01L21/30;H01L21/677 主分类号 G03F7/20
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