| 摘要 |
PURPOSE:To reduce packaging cost, to improve reliability to be as good as that of a flat package and to scale down a package size by wire-bonding a chip and inner lead sections under a condition that a lead is formed onto a substrate, and transfer-molding sections except outer lead sections. CONSTITUTION:A lead with inner lead sections 2 and outer lead sections 3 is shaped onto a flexible board 11 to a specified pattern. A semiconductor chip 12 mounted onto the flexible board 11 and the inner lead sections 2 are bonded by wires 13, and regions except the outer lead sections 3 are transfer- molded with a resin 14. Accordingly, the effects of a change into a large number of pins, miniaturization, etc., as th features of a TAB system(Taper for Automated Bonding) are displayed while the cost of equipment required for packaging can be reduced, and reliability can be improved by transfer molding up to the same degree as a flat package. |
