| 摘要 |
PURPOSE:To efficiently and uniformly heat-treat the surface of a copper substrate by forming a plasma atmosphere on the surface of the substrate and projecting laser light to heat-treat the surface of the substrate. CONSTITUTION:A gas ionizable at low voltage such as Ar or Ne is fed to the surface of a copper substrate and high density plasma having about 10<17>/cm<3> electron density is generated by high frequency or microwave discharge. Laser light is then projected on the surface of the substrate in the plasma atmosphere. The projected laser light is absorbed in the high density plasma and becomes a high density heat source. This heat source heats the surface of the substrate and modifies the surface by hardening due to transformation from the solid phase or by a melting-solidifying process. The surface of the copper substrate is efficiently and uniformly heat-treated over a wide range. |
