| 摘要 |
PURPOSE:To prevent the occurrence of cracks in a semiconductor chip by forming a flow-stop for a junction resin on an edge on the introducing gate side of a molding resin in a chip bed. CONSTITUTION:A lead frame 11 for a semiconductor chip assembly 10 is shaped in a flow stop 12a in which the section of a molding-resin introducing-side edge in a square chip bed 12 is bent to the semiconductor-chip mounting main- surface side in height corresponding to the thickness of a semiconductor chip 102. Consequently, flowing by the next resin molding of the shape of a gelled junction resin 105 piled up onto the chip bed 12 so as to cover the semiconductor chip 102, particularly, thinning at the ridge, corner section, etc., of the semiconductor chip 102 on the gate side where a molding resin is pressed in, is prevented completely. Accordingly, the occurrence of cracks in the semiconductor chip 102 an be prevented. |
