| 摘要 |
PURPOSE:To lower the m.p. of a silver solder alloy without degrading its workability and to improve solderability and joining strength by specifying the component composition of said alloy. CONSTITUTION:The component composition of a silver solder alloy containes, by weight, >=5-200% Ag, 42-60% Cu, 20-45% Zn and 0.5-7% In, and the balance impurities. The reason for adding the specific amt. of In to the alloy consisting of specific components of Ag, Cu, Zn lies in that with the <=0.5% In the wettability of the silver solder cannot be improved and the m.p. thereof cannot be lowered to 850 deg.C or below. Further the reason for specifying the upper limit at 7% lies in that at >=7% it degrades workability considerably and weakens the strength of a soldered joint. |
