| 摘要 |
PURPOSE:To enhance productivity and perform highly accurate bonding even if bonding positions scatter by a method wherein two corners are detected by a camera and a positional error is automatically corrected so as to bond at the center. CONSTITUTION:A device whereby a camera 6 offset from a collet 4 with a certain distance moves together with the collet 4 on a plane is used. Two corners symmetrical with respect to a work bonding position where a die is to be bonded are detected by the camera 6, and the center of these two points is calculated by an arithmetic device. After the bonding position is calculated, an XY table 1 is driven, and the collet 4 is moved to an upper portion of the coordinate of the bonding position and then lowered or raised, to have the die bonded on a work 8. This realizes a die bonding method by which the bonding position can be rapidly and accurately detected. |
